Products-Shanghai DIVISIA Electronic Co., Limited

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Products

IC & Discrete

Die Bonding Silver Sintering Wire Bonding Metrology Automated Optical Inspection (AOI) Encapsulation Singulation, Trim & Form Inspection, Test & Packing
Advanced Packaging

Deposition Solutions Laser Dicing & Grooving Fan-out Bonding Thermo-compression Bonding Hybrid Bonding Inspection, Test & Packing
CMOS Image Sensor In-line Solution

Inline Buffer Curing Wire Bonding Automated Optical Inspection (AOI) Cleaning Lens Holder Attach Die Bonding Test & Calibration Inline Solution
LED / Photonics

FOL Die Bonding Transfer & Bonding Wire Bonding Lens Attach Package Inspection Automation
Kontaktioten
飞纳Phenom

Whatsapp

021-51923363-605

E-mail

divisia-sales@divisia.com.cn

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DIVISIA · Semiconductor Solution Provider

Contact Us

Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai

Tel: 021-51923363-605

Email: divisia-sales@divisia.com.cn

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Shanghai DIVISIA Electronic Co., Limited

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