CM-LinDA

Classification: Inline Buffer

12 "automatic crystal fixing machine

Dimensions

Width x Depth x Height
1,767 x 1,611 x 2,418 mm

Features

Flexible input
ultra-thin wafer processing
Inline Capability
关键词:
- 半导体
- 欧姆接触
- 过渡金属

Keywords: chip frame processing capability system

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Product Consulting

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021-51923363-605

E-mail

divisia-sales@divisia.com.cn

WeChat

DIVISIA · Semiconductor Solution Provider

Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai

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Shanghai DIVISIA Electronic Co., Limited

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