SilverSAM™Series

A Sintering innovation for power electronics, SilverSAM™ delivers an oxidation-free copper-friendly environment, while designed with a film-assisted sintering process to protect the device against damage. Capable of handling multiple substrate formats, the SilverSAM™ is also applicable for interconnections and expandable volume in productivity.

Classification: Silver Sintering

Product Description
Bottom details

Features

Oxidation-free copper-friendly environment
Sintering / Handling
Multiple substrate format
Master card panel (5” x 7”) DBC / AMB
Singulated DBC / AMB
Wafer level
Leadframe power discrete
Applicable for interconnections
Die attach sinter
Die top sinter clip / DTS (DBB) / Flexible circuit
Substrate to heat sink sinter
Expandable volume in productivity
1 Press → 2 Presses → 3 Presses
Other configuration catering to the market
SilverSAM-m
关键词:
- 半导体
- 欧姆接触
- 过渡金属