Rehm VisionXP Vac reflow soldering system
Classification: Silver Sintering
- Product Description
- Bottom details
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2 in 1 no void reflow soldering solution
Reliable welding process
Minimum 2mbar vacuum, effectively reduce the number of solder joint voids
Fast, reliable and vibration-free removal of pores and voids after welding
Keywords: chip frame processing capability system
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Product Consulting
DIVISIA · Semiconductor Solution Provider
Contact Us
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn
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Shanghai DIVISIA Electronic Co., Limited
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