3Ge

Engineered to meet your packaging needs, the 3Ge is an encapsulation innovation that is smart factory ready. Inheriting all the advantages of IDEALmold 3G, the 3Ge boasts greater performance of a 30% faster conversion time, improved mechanical module design and a power-saving pre-heater module. Complete with predictive maintenance software to enhance automation to reduce manual work.

Classification: Encapsulation

Product Description
Bottom details

Features

Ultra High Density (UHD) Solution (100mm W x 300mm L)
1 - 4 press configuration with 170T option
FOL inline & PEP inline integration ready
SECS GEM option ready
Advanced packages option ready
ASMPT patented PGS Top Gate Molding capability
Ready for DSC molding solution
Add the scalable option feature:
PGS top gate molding
DSC (double side cooling) molding
SmartVac cavity vacuum @3 Torr
Output line scan package inspection
Precision wedge substrate compensation
关键词:
- 半导体
- 欧姆接触
- 过渡金属