FT-NEXT18
Classification: Inspection, Test & Packing
- Product Description
- Bottom details
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Features
Latest high speed turret DDR motorizing system with 18 pick heads
Individual up / down driving mechanism further allowing high speed up / down pick head motion
Best in class accuracy for handling small & mini discrete packages
iContact™ for QFN application
Protecting die or package from crack during test
Easy adjustment on contactor for Z-level
Auto compensation on package thickness
iTurret solution for parallel test device
Best Cost of Ownership solution for mid to long test time devices
iNet – AI Deep Learning
Micro crack & micro chipping detection available
Intelligent features for small package
iAlign™ - reduce setup time for minimal adjustment
iRotate™ – no risk on package corner chip
FT-NEXT18 is not for sale in Japan
Applications (Package size: 0.6 x 0.3 – 6 x 6 mm²)
SOT, SOD, SC, QFN, DFN, SMA, sensor, etc.
Keywords: chip frame processing capability system
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Product Consulting
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn