FT-NEXT26
Classification: Inspection, Test & Packing
- Product Description
- Bottom details
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Features
Highest throughput: 40,000+ UPH*
Latest high speed turret DDR motorizing system with 26 pick heads
Individual up / down driving mechanism further allowing high speed up / down pick head motion
iTurret solution for parallel test device
Best Cost of Ownership solution for mid to long test time devices
iContact™ for large and thin QFN application
Protecting die or package from crack during test
Easy adjustment on contactor for Z-level
Auto compensation on package thickness
iNet – AI Deep Learning
Micro crack & micro chipping detection available
Applications (Package size: > 2 x 2 mm²)
BGA, SOIC, TSSOP, MSOP, QFN, DFN, sensor, etc.
Keywords: chip frame processing capability system
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Product Consulting
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn