LASER1205

ASMPT’s laser-based wafer separation machines are leading in Edge quality with lowest Cost of Ownership based on VI dicing and/or Matrix grooving processes. ASMPT has developed a broad portfolio of options for all models to address the specific challenges of our customer’s markets, both for OSAT and tier1 IDM companies. Our latest released model is G-UV-USP which is used for Grooving applications in the Memory market.

Classification: Laser Dicing & Grooving

Product Description
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The platform

The LASER1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.

The ergonomic design, the user-friendly touch screen display and the ease-of-use allow the operator to control the system easily for a wide variety of products. As the LASER1205 systems meet the industrial standards in accordance with CE regulations, no special precautions nor training are required to safely operate the systems.
关键词:
- 半导体
- 欧姆接触
- 过渡金属