FIREBIRD Series
Classification: Thermo-compression Bonding
- Product Description
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Features
Flexible materials handling capability for Heterogeneous Integration in 2D, 2.5D and 3D format
Co-exist die input from both wafer and tape & reel
Field configurable for strip / singulated / wafer substrate
Ultra wide carrier handling for singulated substrate
Direct wafer and glass substrate handling with SlimFEM
Reliable with solid installation bases
> 250 sets installation in mass production
Innovative process
Inert environment enables Liquid Phase Contact (LPC) process for high productivity
Real-time active tip tilt
Keywords: chip frame processing capability system
Product Consulting
DIVISIA · Semiconductor Solution Provider
Contact Us
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn
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Shanghai DIVISIA Electronic Co., Limited
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