AERO CAM Series

Bringing you a new dimension of wire bonding is ASMPT’s AERO CAM, which promises to deliver 30% higher UPH (as compared to typical Cu wire application) and a 22µm bonded ball size. With a bonding accuracy of 2.0µm @ 3σ and application ready up to 30µm. Featuring ASMPT’s patented X-Power thermosonic bonding technology, and ECP looping enhancements and works with our very own intelligent monitoring system AeroEye for better quality assurance.

Classification: Wire Bonding

Product Description
Bottom details

New welding technology

Dimensions

W x D x H
1,284 x 1,550 x 1,760 mm

Features

Up to 30% higher in UPH
for a typical Cu wire application
22μm bonded ball size
Expertly engineered to reduce ball size to 22μm with 0.5mil wire
Application ready up to 30μm
Other configurations catering to the market

AERO CAM-G
AERO CAM-I
关键词:
- 半导体
- 欧姆接触
- 过渡金属