HiPO
The HiPO is ASMPT’s high-performance, smart oven for die, lens, or post-mold curing. Comes with 10 independently controlled curing chambers, and one cooling chamber and offers up to 2 slot magazines per chamber.
Large lead frame handling capacities of a maximum outline (300mx100mm), and a customized slot magazine, for curing by force convection. The HiPO can auto collaborate with an external mobile robot and offers unmanned operation to reduce machine downtime, real-time monitoring and predictive maintenance capabilities.
Classification: Curing
- Product Description
- Bottom details
-
HIgh Performance Curing Oven
Dimensions
W x D x H
1,885 x 2,315 x 2,850 mm
Features10 independently controlled curing chambers and 1 cooling chamber
Large lead frame handling capability of maximum outline 300mm x 100mm
Lead frame in customized slot magazine to be cured by force convection curing process
Up to two slot magazines per chamber
Built-in motorized robot for magazine handling
Upgraded platform to support auto collaboration with external mobile robot
Incorporates adaptor for oxygen analyzer
Programmable generic curing process
Recipe management
Keywords: chip frame processing capability system
Product Consulting
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn