Products and Services
Products and Services

HiPO

The HiPO is ASMPT’s high-performance, smart oven for die, lens, or post-mold curing. Comes with 10 independently controlled curing chambers, and one cooling chamber and offers up to 2 slot magazines per chamber. Large lead frame handling capacities of a maximum outline (300mx100mm), and a customized slot magazine, for curing by force convection. The HiPO can auto collaborate with an external mobile robot and offers unmanned operation to reduce machine downtime, real-time monitoring and predictive maintenance capabilities.

Classification: Curing

  • Product Description
  • Bottom details
  • HIgh Performance Curing Oven

    Dimensions

    W x D x H
    1,885 x 2,315 x 2,850 mm

    Features

    10 independently controlled curing chambers and 1 cooling chamber
    Large lead frame handling capability of maximum outline 300mm x 100mm
    Lead frame in customized slot magazine to be cured by force convection curing process
    Up to two slot magazines per chamber
    Built-in motorized robot for magazine handling
    Upgraded platform to support auto collaboration with external mobile robot
    Incorporates adaptor for oxygen analyzer
    Programmable generic curing process
    Recipe management

    关键词:
    • 半导体
    • 欧姆接触
    • 过渡金属
HiPO
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  • HiPO

Keywords: chip frame processing capability system

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