MS90

MS90 provides a high speed wafer map sorting solution for wide range of applications includes LED, PT/IR, etc. MS90 offers extra large effective binning area up to 105 x 105 mm or 125 x 125 mm and up to 200 output bin frames for large number of bin sorting. Optional up-look inspection capability enhances chip XY placement of CSP (chip scale package) LED. It is your best choice of map sorter.

Classification: FOL

Product Description
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Features

Extra Large effective binning area
With uplook: up to 105 x 105 mm
Without uplook: 125 x 125 mm
High sorting speed
Latest dual arm bond head system
Widely implementing high speed linear and direct drive rotary motion system
Precise XY placement
Standard: ± 38 µm
Optional up-look inspection: ± 10 µm
Die size: 0.15 mm x 0.15 mm ~ 5 mm x 5 mm
Large wafer handling: up to Ø 8” picking area half mode
Up to 200 (25 slots x 8 magazines) output bin frames for large number of bin sorting
Standard: Max 150 bin grade
Motorized XY ejector for faster set-up time
Fast & accurate 1D & 2D barcode scanning system
关键词:
- 半导体
- 欧姆接触
- 过渡金属