Photon Pro
Classification: Die Bonding
- Product Description
- Bottom details
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Features
Patented look-through pattern recognition technology
High precision bonding
XY placement: ± 3 µm @ 3σ
Die rotation: ± 0.1° @ 3σ
Large substrate handling, max 200 mm x 215 mm substrate size
Enhance material traceability by using OCR
Multi-chip bonding capability
Auto bond-tool change, up to 10 bond-tool buffers
Auto wafer change, up to 6 x 6” OD Foton Ring with 2-stage ejector system
High flexibility options to fulfill the requirements of diverse multi-chip packages
Keywords: chip frame processing capability system
Product Consulting
DIVISIA · Semiconductor Solution Provider
Contact Us
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn
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Shanghai DIVISIA Electronic Co., Limited
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