LT300Pro
Classification: Transfer & Bonding
- Product Description
- Bottom details
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Features
High precision transfer placement
XY placement: ± 3.5 µm @ 3σ
Mass transfer technology
> 5 million UPH
Flexible laser transfer
Easy conversion for any die sizes & pixel pitches
Support various laser transfer processes
Blind mode
Selective mode
Refill mode
Maximizing mass transfer yield
Pre-scan wafer before transfer
Post-transfer inspection & re-fill process
Non-toxic laser process
Keywords: chip frame processing capability system
Product Consulting
DIVISIA · Semiconductor Solution Provider
Contact Us
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn
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Shanghai DIVISIA Electronic Co., Limited
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