AD280Plus
Classification: Lens Attach
- Product Description
- Bottom details
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Features
Achieving ± 3 µm @ 3σ XY placement with patented look-through pattern recognition
Flip chip handling capability
Diverse material handling
Standard: Wafer on expander or clamp ring
Optional: Waffle pack, Gelpak, tray, tape feeder or by request
Enhancing traceability by barcode, 2D code or OCR on substrate / wafer / die (Option)
Keywords: chip frame processing capability system
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Product Consulting
DIVISIA · Semiconductor Solution Provider
Contact Us
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn
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Shanghai DIVISIA Electronic Co., Limited
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