CM-OVEN-S
Classification: Lens Holder Attach
Classification: Die Bonding
- Product Description
- Bottom details
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Snap Cure Oven
Dimensions
W x D x H
900 x 1,595 x 1,220 mm
FeaturesFlexible curing profile and curing time setting
Contact cure and Air curing for different applications
Flexible for inline or standalone operation
Universal cone roller for LF transferring, no conversion
Split N2 delivery system, with N2 curtains at oven’s input and output sides to prevent LF oxidation
Electronic flow sensor to improve monitoring and control of N2 flow
N2 temperature control system with thermocouples at heater block and N2 stream
Effective exhaust system for outgassing suction to prevent LF contamination
Dynamic temperature profiling system built into oven
Post curing inspection platform provided
Keywords: chip frame processing capability system
Product Consulting
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn