DA-PRO

Experience high throughput, versatility, and intelligent features with DA-PRO, revolutionizing die bonding for optimal productivity and quality. DA-PRO, the latest 12" automatic die bonder for CMOS, VCSEL, and Microlens Array (MLA) diffuser applications. Achieving a remarkable 5k+ UPH, it offers flexibility for inputting and handling ultra-thin dice to large dice. Equipped with smart dispensing solutions including glue inspection and auto rework, it ensures precise and reliable bonding. High-precision placement control guarantees superior quality assurance. It also has inline capability with AIoT integration, enabling efficient operation within ASMPT Smart COB Inline for smart manufacturing needs.

Classification: Lens Holder Attach

Classification: Die Bonding

Product Description
Bottom details

Dimensions
W x D x H
2,093 x 1,637 x 2,129 mm

Features

Ultra-thin die to large die handling
High-precision placement control
ASMPT smart dispensing solutions
In-line capability with AIoT
CE mark ready
关键词:
- 半导体
- 欧姆接触
- 过渡金属