LA-PRO
The demand for higher-resolution camera sensors in portable electronic devices is rapidly growing. To meet the evolving needs of technology and accuracy, ASMPT proudly presents LA-PRO, our latest automatic lens holder bonding system.
With a 4-head pick and place system, it achieves an impressive 4K UPH production rate. LA-PRO combines a state-of-the-art bond head system, moving platform work holder, and high-resolution vision system for exceptional bonding performance. Its flexibility, accommodating various substrate sizes and enabling quick package conversion, makes LA-PRO the ideal choice for lens holder bonding solutions.
Classification: Lens Holder Attach
Classification: Die Bonding
- Product Description
- Bottom details
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Automatic Lens Holder Bonder
Dimensions
W x D x H
2,465 x 1,919 x 2,242 mm
FeaturesQuad-dispenser and 4 heads pick-and-place system to maximize throughput with 4K UPH
All-round PR system for precise placement
ASMPT dispensing system: glue inspection and auto rework
In-line capability with AIoT to achieve factory automation
Keywords: chip frame processing capability system
Product Consulting
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn