Products and Services
AD832i (silver paste solid crystal)
Automatic Die Bonding System(8” wafer handling)
Classification: Die Bonding
- Product Description
- Bottom details
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Features
Ultra small dot dispensing capability
Capable of ultra-small dice handling
Capable of high-density leadframe handling
Patented bond head design
Dual dispensing system
Graphical SPC data with latest IQC system
Keywords: chip frame processing capability system
Product Consulting
DIVISIA · Semiconductor Solution Provider
Contact Us
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn
Please scan the two-dimensional code attention
Shanghai DIVISIA Electronic Co., Limited
WeChat Public Number
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