AD832U (eutectic solid crystal)

Integrating with ultra high speed and excellent accuracy, AD832U is an automatic eutectic die bonder for a large range of horizontal small discrete packages, such as SOD323, SOD923 and SOT113 etc. Together with 300 x 100 mm² handling capability, this high speed eutectic die bonder should be your first choice for maximum 8” wafer size eutectic die bonding system in present and next generation.

Classification: Die Bonding

Product Description
Bottom details

Features

Leading throughput
Enhanced manufacturing area efficiency
Capable of high density lead frame handling
Optional to equip with various modules to achieve
Multi-angle bonding
Flux eutectic / epoxy bonding
关键词:
- 半导体
- 欧姆接触
- 过渡金属