AD8312FC (chip-on-chip)

Specially designed for low pin count flip chip packages, AD8312FC provides a high speed automatic flip chip bonding solution for packages such as SOIC, SO, QFN, BGA, LGA and more. In order to handle versatile packages, it is also able to handle direct die bonding process. Augmented with high-speed bonding performance, excellent accuracy complete with inline capabilities, the AD8312FC is a perfect fit for your high volume assembly solution.

Classification: Die Bonding

Product Description
Bottom details

Features

2-in-1 flip chip and direct die attach machine
Simple and easy conversion between two processes
High speed bonding with patented double decoupled bond head system
Supporting all-round inspection algorithms at various locations
Excellent placement accuracy
High density lead frame handling capability
关键词:
- 半导体
- 欧姆接触
- 过渡金属