POWER VECTOR (multi-chip module bonding)

A die tacking solution for Ag/Cu Sintering, the POWER VECTOR features a high bond force heated bond head, and Ag Sintering materials handling capabilities, complete with Ag film stamping, automated handling of Ag film for HVM. Also featuring flexible MCM capabilities, with die and component input formats and an automatic tool changing system. Comes with a thin die handling capabilities too.

Classification: Die Bonding

Product Description
Bottom details

Features

Die and component tacking for silver (Ag) sintering process
Equipped with thermal compression (TC) bond head
Bond stage heating capability
High bond force
Silver (Ag) sintering material handling
Silver (Ag) film stamping
Automated handling with Ag film for HVM
Flexible MCM capabilities
Flexible die and component input formats: wafer | TnR | waffle pack | JEDEC tray
Automatic tool changing system
Ejectors, pick & bond collets
Thin die handling capability
关键词:
- 半导体
- 欧姆接触
- 过渡金属