SD8312 (soft tin solid crystal)

Specially designed for power semiconductor market, ASMPT now presents the cutting-edge soft solder die bonder – SD8312 for your power devices, e.g. SOT223, TO-92, TO-220, DPAK matrix, etc. SD8312 offers 12” wafer handling and industry’s leading productivity with highest density lead frame handling capability which is the best to fit for your today’s and next generation demand.

Classification: Die Bonding

Product Description
Bottom details

Features

New generation SD8312 sets new industry record for 12" soft solder die bonding process
High density lead frame handling with universal workholder design
High speed performance combining proven technologies with high-tech innovations
Sophisticated oxygen level control
Capable of AB dice handling
关键词:
- 半导体
- 欧姆接触
- 过渡金属