Products and Services
Products and Services

HERCULES LM

Heavy Aluminum Wire Bonding System (for Module-based Applications)

Classification: Wire Bonding

  • Product Description
  • Bottom details

  • Features

    High speed with excellent bonding quality
    4 – 20mil Al wire handling capability
    3mil / 25mil Al wire handling by same bondhead (optional)
    10 – 20mil Cu wire handling capability
    Large effective bonding area: 450 x 310 mm
    Specific design for power package and modules applications
    IGBT module
    DBC panel




     

    关键词:
    • 半导体
    • 欧姆接触
    • 过渡金属
Tel: 021-51923363-605
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Keywords: chip frame processing capability system

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DIVISIA · Semiconductor Solution Provider

Contact Us

  Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai

  Tel: 021-51923363-605

  Email: divisia-sales@divisia.com.cn

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