HERCULES (Wedge)

The HERCULES is the new generation automatic heavy aluminum wire bonding system that allows high-speed bonding for wide range of power packages and module applications. Leveraging on ‘iCut’ an ASMPT developed advanced cutting process to ensure utmost wire cutting accuracy. With 4 – 20mil Al wire handling capability, and a large, effective bonding area of 110 x 130mm and a multi-row substrate handling capabilities. The HERCULES is also widely applicable for power packages and modules applications (TO Series, DPAK matrix, Power Modules).

Classification: Wire Bonding

Product Description
Bottom details

Features

Hybrid wire bonding capability with dual bond heads system
Linear motor and DDR system
"Smart BQM" system supervising bonding quality
Integration of wire pull testing system (option)
关键词:
- 半导体
- 欧姆接触
- 过渡金属