Eagle AERO (Ball Welding)

One of our most popular products, the Eagle AERO is the pioneer product to be imbued with the now patented X-Power, thermosonic bonding technology in the wire bonding process, supported by the Aeroducer transducer that supports a dual frequency of X and Y direction. Built with great management software like AeroEye for smarter monitoring and quality assurance.

Classification: Wire Bonding

Product Description
Bottom details

Features

Up to 30% higher in UPH
for a typical Cu wire application
22μm bonded ball size
Expertly engineered to reduce ball size to 22μm with 0.5mil wire
Application ready up to 30μm
Other configurations catering to the market
iHawk AERO: for low pin count discrete applications
关键词:
- 半导体
- 欧姆接触
- 过渡金属