Panel Plating – Stratus™ P500
Classification: Deposition Solutions
- Product Description
- Bottom details
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Applications
Configurable for up to 5 metals
Multi-chip Fan Out
SoC packages
MicroLED
Features
Wafer level precision hardware and software
Cu, Sn(Ag), Ni & Au plating @<10µm L/S
Single/Dual sided plating
Membrane cells provide high chemistry utilization
Multi-zone anodes for optimized uniformity with thick and thin seeds
Patterned shields for uniform high throughput plating
Substrates
510×515 mm panels, custom
Glass, Composite, Other
Keywords: chip frame processing capability system
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Product Consulting
DIVISIA · Semiconductor Solution Provider
Contact Us
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn
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Shanghai DIVISIA Electronic Co., Limited
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