Wafer Plating – Stratus™ P300
Classification: Deposition Solutions
- Product Description
- Bottom details
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Applications
Configurable for up to 5 metals
UBM/RDL
Fan Out
RF Filters
Power Devices
Features
True Bridge tool capability: Size Change
Degas/Anneal
ICP/CCP Etch
Substrates
200 and 300 mm wafers
Warped and heavy wafer processing
Silicon, EMC, RCP, Glass, Bonded
Other Products
Apollo 200
Keywords: chip frame processing capability system
Product Consulting
DIVISIA · Semiconductor Solution Provider
Contact Us
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn
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Shanghai DIVISIA Electronic Co., Limited
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