AB550

Automatic Wire Bonder

Classification: Wire Bonding

Features

High speed wire bonding: 9 wires/sec
Fine pitch handling capability
Smallest bond pad size: 63 µm x 80 µm
Finest pad pitch: 68 µm
Innovative PR technology: PR On The Fly
Shorten alignment time
Especially fit for high density substrate, e.g. RFID, multi-die on multi-PCB
Extra large effective bonding area, up to Ø 100 mm
More precise & reduced error of rotation (EOR) due to optimized DDR motor
Despite enlarged the workchuck, increased the radius of rotation, bonding accuracy has been greatly enhanced
Enhanced multi-PCB handling capability comparing to AB530
Effective bonding area: ↑ 75%
Higher bonding capacity
Reducing load/unload frequency, saving labor costs
Average labor time for load/unload per PCB: ↓ 56%
关键词:
- 半导体
- 欧姆接触
- 过渡金属