AB589 Series

Automatic Wire Bonder

Classification: Wire Bonding

Features
High speed wire bonding: 6.5 wires/sec
Fine pitch capability: 55 µm x 65 µm
Innovative PR technology: PR On The Fly
Shorten alignment time
Latest rotary bond head design enhancing stability and reliability
Extra large effective bonding area: 8” x 6”
Supporting various workholder design for full range application
Saving human resources
Capable to handle raw PCB, vertical integrating the production material capability of the entire production line
Saving time of manual load/unload, simplify the bonding, testing and packaging processes
AB589-H Automatic material handling capability (option)
Gold wire wedge bonding capability (option)
Deep access bonding capability
45° bonding angle (option)
关键词:
- 半导体
- 欧姆接触
- 过渡金属