AeroLED
Classification: Wire Bonding
- Product Description
- Bottom details
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Features
High speed wire bonding: 24 wires/sec for 2mm
35 µm bonded ball size
Dual directional transducer
XY-table of stable state
Precision control wire clamp gap
All material FAB controlled box
Nano driver solution
Keywords: chip frame processing capability system
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Product Consulting
DIVISIA · Semiconductor Solution Provider
Contact Us
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn
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Shanghai DIVISIA Electronic Co., Limited
WeChat Public Number
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