Another domestic enterprise SSD and megacore complete compatible mutual authentication

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【概要描述】Recently, Yingren Technology announced that its NVMe SSD and SATA SSD products under the enterprise SSD Dongting series have completed the functions, performance, compatibility, reliability and stability on the KH-40000, KH-30000, KH-20000, KX-6000, KX-5000, ZX-C and ZX-C series processor platforms of Shanghai Zhaoxin Integrated Circuit Co., Ltd. (hereinafter referred to as "Zhaoxin"), which can meet the application requirements of users and obtain mutual recognition of product compatibility.

Recently, Yingren Technology announced that its NVMe SSD and SATA SSD products under the enterprise SSD Dongting series have completed the functions, performance, compatibility, reliability and stability on the KH-40000, KH-30000, KH-20000, KX-6000, KX-5000, ZX-C and ZX-C series processor platforms of Shanghai Zhaoxin Integrated Circuit Co., Ltd. (hereinafter referred to as "Zhaoxin"), which can meet the application requirements of users and obtain mutual recognition of product compatibility.

According to the data, Yingren Technology was established in 2017 to provide solutions such as storage master chip, solid state drive (SSD) and storage system. At present, the company has mass produced 8 solid-state hard disk master chips and streaming chips, covering a variety of applications from SATA to PCIe.

At present, Yingren Technology has two enterprise-class SSD product series, respectively for the NVMe SSD market and SATA SSD market, the two product series from the master to the flash memory are domestic, of which, SSD controllers are independent research and development of Yingren Technology master control products.

Yingren Technology's enterprise-class SSD can be widely used in data centers and cloud computing, and radiate to industries such as finance, telecommunications, transportation, medical care, education, government and public affairs.

Ease the pressure to expand production, TSMC, Samsung, Intel will be subsidized by the U.S. Chip Act in March.

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Ease the pressure to expand production, TSMC, Samsung, Intel will be subsidized by the U.S. Chip Act in March.

None

Keywords: chip frame processing capability system

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Another domestic enterprise SSD and megacore complete compatible mutual authentication