31
2024
-
01
Ease the pressure to expand production, TSMC, Samsung, Intel will be subsidized by the U.S. Chip Act in March.
Classification:
【概要描述】In fact, the CHIPS Act was enacted in the United States to promote local semiconductor investment by related companies. According to the bill, each project can receive a funding subsidy of up to $3 billion, equivalent to 15% of the total project cost. In addition, the bill's support for semiconductor investment, in addition to funds, also includes loans, loan guarantees and tax deductions, providing a total amount of $39 billion.
Recently, the media reported that the United States will issue subsidy funds for the first quarter under the CHIPS Act, which will bring significant benefits to Intel, Samsung Electronics and TSMC, which have invested in local businesses.
The United States is expected to announce the details of semiconductor funding subsidies under the CHIPS Act on February 29, and the timing of its subsidy funds may fall in March. It is expected that the scope of subsidies will include semiconductors used in smart phones, artificial intelligence and other fields.
In fact, the CHIPS Act was enacted in the United States to promote local semiconductor investment by related companies. According to the bill, each project can receive a funding subsidy of up to $3 billion, equivalent to 15% of the total project cost. In addition, the bill's support for semiconductor investment, in addition to funds, also includes loans, loan guarantees and tax deductions, providing a total amount of $39 billion.
The report stressed that although the U.S. government passed the CHIPS Act in 2022, which is expected to cost $53 billion, only two companies have received financial subsidies from the CHIPS Act, which currently claims to have applied for more than 170 companies.
In the case of global wafer foundries capable of producing advanced processes, including TSMC, Intel and Samsung, all three companies have announced investments in related new semiconductor production lines in the United States. Among them, TSMC is building two fabs near Phoenix, Arizona, with an investment of up to $40 billion. With this amount estimated, TSMC is expected to receive about billions of dollars in financial subsidies from the US government.
Intel is also building semiconductor production lines worth more than $43.5 billion in Arizona, Ohio, New Mexico and Oregon. At this amount, Intel is also expected to receive billions of dollars in U.S. government funding.
Samsung Electronics is currently building a $17.3 billion production line near Dallas, Texas, and is expected to receive up to $3 billion in U.S. government funding.
Keywords: chip frame processing capability system
Related recommendations
Room 618, Building 3, Biyun International, 277 Zheqiao Road, Pudong New Area, Shanghai
Tel: 021-51923363-605
Email: divisia-sales@divisia.com.cn