Signing of 3 billion Yuan Anjeli Meiwei Packaging Board Project

Classification:

【概要描述】Judging from the current public DRAM (memory) technology, the industry believes that 3D DRAM is one of the ways to crack the DRAM technology dilemma and is an important development direction of the future memory market.

According to Nansha Investment News, on January 30, the Investment Promotion Bureau of Guangzhou Nansha Economic and Technological Development Zone and Ageli Meiwei Company held a project investment agreement signing ceremony. The project will expand the current investment scale in Nansha and build an integrated circuit emerging industrial park and a national technology and R & D platform.

According to the source, at present, the Nansha plant area of the project covers an area of about 139 mu, and about 90 mu has been built. After signing the contract, the project plans to build an integrated circuit packaging carrier board and a class carrier board emerging industrial park integrating product design, research and development, reliability testing, and multiple pilot production lines in the vacant plot of the original factory area. At the same time, two national technology and research and development platforms-the national integrated circuit packaging carrier board engineering technology center and the national integrated circuit packaging carrier board laboratory will be built. The project covers an area of about 49 mu, with a total investment of 3 billion yuan and an annual output value of 3.5 billion yuan.

According to the data, Ageli Meiwei is one of the most comprehensive flexible packaging substrates, rigid-flex bonding boards and their module research and development and manufacturing enterprises in China, mainly developing and manufacturing flexible circuit carrier boards and their module components.

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Ease the pressure to expand production, TSMC, Samsung, Intel will be subsidized by the U.S. Chip Act in March.

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Ease the pressure to expand production, TSMC, Samsung, Intel will be subsidized by the U.S. Chip Act in March.

Keywords: chip frame processing capability system

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Signing of 3 billion Yuan Anjeli Meiwei Packaging Board Project

Judging from the current public DRAM (memory) technology, the industry believes that 3D DRAM is one of the ways to crack the DRAM technology dilemma and is an important development direction of the future memory market.

Ease the pressure to expand production, TSMC, Samsung, Intel will be subsidized by the U.S. Chip Act in March.

In fact, the CHIPS Act was enacted in the United States to promote local semiconductor investment by related companies. According to the bill, each project can receive a funding subsidy of up to $3 billion, equivalent to 15% of the total project cost. In addition, the bill's support for semiconductor investment, in addition to funds, also includes loans, loan guarantees and tax deductions, providing a total amount of $39 billion.

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